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 BSP 372
SIPMOS (R) Small-Signal Transistor
* N channel * Enhancement mode * Logic Level * Avalanche rated * VGS(th) = 0.8 ...2.0 V Pin 1 G Pin 2 D Pin 3 S Pin 4 D
Type
VDS
100 V
ID
1.7 A
RDS(on)
0.31
Package
Marking
BSP 372
Type BSP 372
SOT-223
Ordering Code Q 67000-S300
Tape and Reel Information E6327
Maximum Ratings Parameter Symbol Values Unit
Continuous drain current
TA = 28 C
ID
A 1.7
DC drain current, pulsed
TA = 25 C
IDpuls
6.8
EAS
Avalanche energy, single pulse
ID = 1.7 A, VDD = 25 V, RGS = 25 L = 23.3 mH, Tj = 25 C
mJ
45
VGS Vgs Ptot
Gate source voltage Gate-source peak voltage,aperiodic Power dissipation
TA = 25 C
14 20
V
W 1.8
Data Sheet
1
05.99
BSP 372
Maximum Ratings Parameter Symbol Values Unit
Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1) Thermal resistance, junction-soldering point 1) IEC climatic category, DIN IEC 68-1
Tj Tstg RthJA RthJS
-55 ... + 150 -55 ... + 150
C
70 10
55 / 150 / 56
K/W
1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Values typ. max. Unit
Drain- source breakdown voltage
VGS = 0 V, ID = 0.25 mA, Tj = 0 C
V (BR)DSS
V 100 -
Gate threshold voltage
VGS=VDS, ID = 1 mA
V GS(th)
0.8
IDSS
1.4
2 A
Zero gate voltage drain current
VDS = 100 V, V GS = 0 V, Tj = 25 C VDS = 100 V, V GS = 0 V, Tj = 125 C
IGSS
0.1 10
1 100 nA
Gate-source leakage current
VGS = 20 V, VDS = 0 V
RDS(on)
10
100
Drain-Source on-state resistance
VGS = 5 V, ID = 1.7 A
0.24 0.31
Data Sheet
2
05.99
BSP 372
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Values typ. max. Unit
Transconductance
VDS 2 * ID * RDS(on)max, ID = 1.7 A
gfs
S 2 3.7 pF 415 520
Input capacitance
VGS = 0 V, V DS = 25 V, f = 1 MHz
Ciss
Output capacitance
VGS = 0 V, V DS = 25 V, f = 1 MHz
Coss
Crss
80
100
Reverse transfer capacitance
VGS = 0 V, V DS = 25 V, f = 1 MHz
td(on)
50
65 ns
Turn-on delay time
VDD = 30 V, VGS = 5 V, ID = 0.3 A RG = 50
tr
20
30
Rise time
VDD = 30 V, VGS = 5 V, ID = 0.3 A RG = 50
td(off)
35
55
Turn-off delay time
VDD = 30 V, VGS = 5 V, ID = 0.3 A RG = 50
tf
110
165
Fall time
VDD = 30 V, VGS = 5 V, ID = 0.3 A RG = 50
-
50
75
Data Sheet
3
05.99
BSP 372
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Values typ. max. Unit
Reverse Diode
Inverse diode continuous forward current
TA = 25 C
IS
A 1.7
Inverse diode direct current,pulsed
TA = 25 C
ISM
V SD
-
6.8 V
Inverse diode forward voltage
VGS = 0 V, IF = 1.7 A
trr
0.85
1.1 ns
Reverse recovery time
VR = 30 V, IF=lS, diF/dt = 100 A/s
Qrr
65
C
Reverse recovery charge
VR = 30 V, IF=lS, diF/dt = 100 A/s
-
0.11
-
Data Sheet
4
05.99
BSP 372
Power dissipation Ptot = (TA)
Drain current ID = (TA) parameter: VGS 5 V
1.8 A
2.0 W
Ptot
1.6 1.4
ID
1.4 1.2
1.2 1.0 1.0 0.8 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 C 160 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 C 160
TA
TA
Safe operating area ID=f(VDS) parameter : D = 0, TC=25C
Transient thermal impedance Zth JA = (tp ) parameter: D = tp / T
10 2 K/W 10 1
ZthJA
10 0
10 -1 D = 0.50 0.20 0.10 10 -3 single pulse 10
-4
10 -2
0.05 0.02 0.01
10 -5 -8 -7 -6 -5 -4 -3 -2 -1 0 10 10 10 10 10 10 10 10 s 10
tp
Data Sheet
5
05.99
BSP 372
Typ. output characteristics ID = (VDS) parameter: tp = 80 s
3.8 A 3.2
k l j h Ptot = 2W g i fe d
Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C
1.0
c
VGS [V] a 2.0
b c 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0
RDS (on) 0.8
0.7 0.6 0.5 0.4 0.3 0.2 0.1
VGS [V] =
a 2.5 2.0 b 3.0 c 3.5 d 4.0 e f 4.5 5.0 g 6.0
a
ID
2.8 2.4 2.0 1.6 1.2 0.8 0.4
d e f g h i
b
j k l
b c d feg h k
i
j
h i 7.0 8.0
j 9.0
k 10.0
0.0 a 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
V
5.0
0.0 0.0
0.2
0.4
0.6
0.8
1.0
A
1.4
VDS
ID
Typ. transfer characteristics ID = f(VGS)
Typ. forward transconductance gfs = f (ID)
parameter: tp = 80 s
VDS 2 x ID x RDS(on)max
6.5 A 5.5
ID
parameter: tp = 80 s,
V DS2 x ID x RDS(on)max
6.5 S 5.5
gfs
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6 7 8 V
VGS
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5
10
0.0 0.0
1.0
2.0
3.0
4.0
A
ID
6.0
Data Sheet
6
05.99
BSP 372
Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 1.7 A, VGS = 5 V
1.0
Gate threshold voltage VGS (th) = (Tj ) parameter: VGS = VDS, ID = 1 mA
4.6 V 4.0
RDS (on)
0.8 0.7 0.6 0.5 0.4 0.3
VGS(th)
3.6 3.2 2.8 2.4
98% 98% typ
2.0 1.6 1.2
typ
0.2 0.1 0.0 -60
2%
0.8 0.4 -20 20 60 100 C 160 0.0 -60 -20 20 60 100 C 160
Tj
Tj
Typ. capacitances
C = f (VDS)
parameter:VGS=0V, f = 1 MHz
10 4
Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s
10 1
pF
C
A
IF
10 3 10 0
Ciss
10 2
Coss Crss
10 -1
Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%)
10 1 0
5
10
15
20
25
30
V
VDS
40
10 -2 0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Data Sheet
7
05.99
BSP 372
Avalanche energy EAS = (Tj) parameter: ID = 1.7 A, VDD = 25 V RGS = 25 , L = 23.3 mH
50 mJ
Drain-source breakdown voltage V(BR)DSS = (Tj)
120 V 116
EAS
40 35 30 25 20 15 10 5 0 20
V(BR)DSS 114
112 110 108 106 104 102 100 98 96 94 92 90 -60
40
60
80
100
120
C
160
-20
20
60
100
C
160
Tj
Tj
Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25C
Data Sheet
8
05.99


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